IG-OSP – Inside Plant (ISP) and Outside Plant (OSP) Grounding and Bonding

IG-OSP Course


  • Certificate of Attendance
  • 21 BICSI ITS CEC’s
  • $1350USD – per person for suitcase training
  • Pricing includes ALL related shipping and travel expenses
  • For Canadian or other international courses, contact us at info@iground.biz for your qualified pricing structure.

iGround Training Brochure (PDF)

Course Objective

The objective for the IG-OSP course is to provide attendees the necessary information to design, install, maintain, and troubleshoot grounding and bonding systems as they relate to Inside Plant (ISP) structured cabling and Outside Plant (OSP) locations; including maintenance holes, pedestals, aerial, and direct buried locations.

Prerequisites

None but basic electrical properties knowledge and some telecommunication experience a plus.

Course Description

The IG-OSP 4-day course will present the subjects relevant to OSP bonding infrastructure designs and installations. This non-vendor specific training will focus on both theoretical and practical knowledge of the different OSP configurations.

This course provides expert instruction beginning with the basic electrical properties and some of the myths that permeate the industry in regards to electrical principles and grounding systems. The full-color manual has plenty of high-resolution photographs to see the good, the bad, and the downright ‘ugly’ of electrical grounding and telecommunication system bonding poor design/installation OSP practices.

The IG-OSP class has ‘hands-on’ portions that will offer the latest information on recommended test procedures, instrument techniques, and site survey testing checklists that are applicable for all types of systems and configurations.

Knowledge check quizzes are provided throughout the book so the student can better comprehend the material to answer the exact questions that may be posed to them during the design and installation process.

Throughout the instruction, IG-OSP will emphasize relevant codes and standards such as the BICSI OSP Design Reference Manual, IEEE Green and Emerald books, the National Electrical Safety Code (NESC), the National Electrical Code (NEC), Underwriters Laboratories (UL), and others.

This class can be suited for open enrollment or suitcase training (with suitable space at customer facilities).

 

Course Outline

Introduction

  • Instructor Introduction
  • Class Introduction
  • Purpose of Class
  • Review of Manual

Chapter One – Grounding and Bonding Overview

  • Purpose of Grounding (Earthing)
  • Grounding versus Bonding
  • General Components
  • Grounding for Safety
  • Grounding for Lightning Protection
  • Relevant Standards

Chapter Two – Electrical Fundamentals and Review

  • Review of Electrical Fundamentals
  • Voltage
  • Valence Bands & Free Electrons
  • Electrical Current
  • Electrical Resistance
  • Electromagnetic Fields
  • Ohm’s Law
  • Impedance Characteristics
  • Inductive and Capacitive Reactance
  • Types of Alternating Current Waveforms
  • Parallel and Series Resonance
  • Waveform Propagation on Grounding/Bonding Conductors
  • Lightning and Lightning Generation
  • Step Potential Conditions
  • Touch Potential Conditions
  • Transferred Earth Potential Conditions
  • Minimizing Transferred Earth Potentials

Chapter Three – Earthing (Grounding Electrode) System

  • Review of Purposes
  • Review of Components
  • Soil Resistivity Calculations
  • Soil Resistivity Exercise
  • Earth Ground Resistance Basics
  • Earth Ground Resistance Shell Calculations.
  • Earth Ground Resistance Testing (Hands-on)
  • Review of Results
  • Alternative Test Methods
  • Earthing Variables
  • Electrolytic and Galvanic Corrosion

Chapter Four – Equipment Grounding System

  • Review of Purposes
  • Review of Components
  • Basics of Electrical Wiring
  • Measurement of Conduit Resistances
  • Personnel Safety
  • Simulated Fault Circuit
  • Improper Neutral/Ground Bonding
  • Effects of N/G Bonding on Telecommunications sites
  • Harmonics and its Effects on the Neutral Conductor

Chapter Five – Telecommunications Bonding System

  • Telecommunications Bonding Basics
  • Joint Standard 607C and application
  • BICSI TDMM and application
  • Telecommunication Bonding Conductor Sizing
  • Conductor Calculation Lab
  • Data Center Bonding
  • Raised Floor Bonding
  • Bonding of Equipment Racks and Trays
  • Bonding Concerns for Multiple Buildings
  • Multiple Building Grounding
  • Telecommunications Bonding Measurements
  • Site Survey Examples
  • Busbar Inspections
  • Telecommunications Bonding Lab (1 hour)
  • Review Results
  • Bonding Resistance between Cable Trays

Chapter Six – Maintenance/Troubleshooting

  • Systematic Approach
  • Tools Needed
  • Visual Approach
  • Mechanical Approach
  • Metering/Testing
  • Sample Checklist
  • Sample Site Survey Report
  • Voltage Quality Review
  • Voltage Quality Issues
  • VQ mitigation methods
  • Wiring and Ground Lab (1.5 hours)
  • Review Results

Chapter Seven – OSP Bonding System

  • Telecommunications Bonding Basics
  • Joint Standard 607C and application
  • BICSI OSPDRM guidelines
  • Bonding Techniques of Various Applications
    • Manholes
    • Pedestals
    • Aerial
    • Direct Buried
    • Trenches
  • Telecommunication Bonding Conductor Sizing
  • Conductor Calculation Lab
  • Bonding Concerns for Multiple Buildings
  • Radio/ Cell Tower Applications
  • Surge Protector Grounding and Examples
  • Telecommunications Bonding Measurements
  • Telecommunications Bonding Lab

Chapter 8 – Glossary of Terms

Please call (407) 814-3648 to inquire about pricing and scheduling.